By Hao Yu,Chuan-Seng Tan,Chuan Seng Tan
3D integration is an rising know-how for the layout of many-core microprocessors and reminiscence integration. This booklet, Advances in 3D built-in Circuits and Systems, is written to aid readers comprehend 3D built-in circuits in 3 levels: machine fundamentals, method point administration, and actual designs.
Contents awarded during this booklet comprise fabrication innovations for 3D TSV and 2.5D TSI; machine modeling; actual designs; thermal, energy and I/O administration; and 3D designs of sensors, I/Os, multi-core processors, and memory.
Advanced undergraduates, graduate scholars, researchers and engineers may well locate this article priceless for realizing the numerous demanding situations confronted within the improvement and construction of 3D built-in circuits and systems.
Read Online or Download Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems) PDF
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Extra info for Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)
Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems) by Hao Yu,Chuan-Seng Tan,Chuan Seng Tan